(EMAILWIRE.COM, November 03, 2018 ) Encapsulation is generally adopted in packaging of lamp-LEDs. The encapsulation procedure is to pour liquid epoxy into the LED moulding chamber first, and then insert the LED bracket that has undergone the press welding, then put the mould into the oven, and the LED gets shaped when the epoxy solidifies.

Over the next five years, it is projected that LED Encapsulation will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

This report covers the present scenario (with the base year being 2017) and the growth prospects of global LED Encapsulation market for 2018-2023.

This report presents a comprehensive overview, market shares, and growth opportunities of LED Encapsulation market by product type, application, key manufacturers and key regions.

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The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Dow
Nusil
H.B. Fuller
Shin-Etsu Chemical
Henkel
KYOCERA
Hitachi Chemical
Panasonic
Epic Resins
Intertronics

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To calculate the market size, it is considered value and volume generated from the sales of the following segments:

Segmentation by product type:
Epoxy
Silicone
Polyurethane

Segmentation by application:
Consumer electronics
Automotive
Telecommunication
Medical

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Some Points From Table of Content:
1 Scope of the Report
2 Executive Summary
3 Global LED Encapsulation by Players
4 LED Encapsulation by Regions
5 Americas
6 APAC
7 Europe
8 Middle East & Africa
Continued…

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