Global 3D ICs Market - Current Trends, Advanced Technology and Future Opportunities by 2023
The global 3D ICs market is a very dynamic market and is expected to witness stable growth over the forecast period. The growth of the 3D ICs market is influenced by the increasing demand for advanced electronic products with a smaller form factor, and
(EMAILWIRE.COM, June 20, 2018 ) Woodridge, USA Jun 2018(News) - The growing semiconductor & microelectronics industry is developing a trend for vertically stacked integrated circuits (ICs) which is emerging as viable solution for providing high performance, increased functionality and reducing power consumption to fulfill electronic device requirements. These ICs are in great demand by military & aerospace, medical and consumer electronics industries to fulfill need of integrating disparate technologies which includes logic, memory, RF, sensor in small forms for industrial applications.
The Global 3D ICs Market is a very dynamic market and is expected to witness stable growth over the forecast period. The growth of the 3D ICs market is influenced by the increasing demand for advanced electronic products with a smaller form factor, and superior functionality has driven semiconductor industry to develop more innovative advanced packaging technologies and high demand for 3D packaging using TSVs driving 3D IC development. However, technical limitation and IC/package co-design are the factors hindering the growth of the 3D ICs market.
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Objective Study of 3D ICs Market:
To provide detailed analysis of the market structure along with forecast of the various segments and sub-segments of the global 3D ICs market.
To provide insights about factors affecting the market growth.
To analyze the global 3D ICs market based porters five force analysis etc.
To provide historical and forecast revenue of the market segments and sub-segments with respect to four main geographies and their countries- North America, Europe, Asia, and Rest of the World (ROW).
To provide country level analysis of the market with respect to the current market size and future prospective.
To provide country level analysis of the market for segment by type, end-users and region.
To provide strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market.
For the purpose of this study, Market Research Future has segmented the market of 3D ICs into technology, components, products, application and region.
Technology-
3D Stacked ICs
3D Monolithic ICs
Components-
Through Silicon Vias (TSVs)
Through Glass Vias (TGVs)
Others
Product-
CMOS Image Sensors
3D Memory
MEMS & Sensors
Light Emitting Diodes (LEDs)
Applications-
IT/Telecommunications
Consumer Electronics
Industrial
Aerospace & Defence
Automotive
Medical
Region
North-America
Europe
Asia-Pacific
RoW
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Key Players:
The key players in the global 3D IC market include Xilinx Inc.
Tezzaron Semiconductor Corporation
BeSang Inc.
Monolithic 3D Inc.
United Microelectronics Corporation
3M Company
Intel Corporation
IBM Corporation among others.
Regional Analysis:
North America is the leading economy in 3D ICs market followed by Europe. However, Asia-Pacific is the fastest growing economy in the market majorly due to maturing production sector in India and China and largest production of semiconductor industry Also, Middle East & Africa has a slow growth majorly due to growing industrialization and presence of automobile industries in this region.
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Key Findings:
Global 3D ICs technology market has reached USD 4,045.87 million in 2016 and is projected to exhibit USD 10,476.60 million by the end of 2023 with a growing CAGR of 17.18%.
By technology, 3D ICs market is dominated by 3D stacked ICs which has generated USD 3,442.07 million in 2016 and projected to reach USD 8,656.95 million by the end of 2022 with 16.62% CAGR. Whereas, monolithic 3D ICs is expected to be the fastest growing market with 20.18% CAGR during forecast period 2016-2022. The high demand for cost saving and high performance logical chips is driving the 3D ICs market in the near future.
Global 3D ICs component market is dominated by through silicon vias (TSVs) which has generated USD 2,570.92 million in 2016 and projected to reach USD 7,332.03 million by the end of 2022. It also expected to be the fastest growing market with 19.08% CAGR during forecast period 2016-2022.
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The Global 3D ICs Market is a very dynamic market and is expected to witness stable growth over the forecast period. The growth of the 3D ICs market is influenced by the increasing demand for advanced electronic products with a smaller form factor, and superior functionality has driven semiconductor industry to develop more innovative advanced packaging technologies and high demand for 3D packaging using TSVs driving 3D IC development. However, technical limitation and IC/package co-design are the factors hindering the growth of the 3D ICs market.
Get Free Sample Report: https://www.prominentmarketresearch.com/sample-report/167
Objective Study of 3D ICs Market:
To provide detailed analysis of the market structure along with forecast of the various segments and sub-segments of the global 3D ICs market.
To provide insights about factors affecting the market growth.
To analyze the global 3D ICs market based porters five force analysis etc.
To provide historical and forecast revenue of the market segments and sub-segments with respect to four main geographies and their countries- North America, Europe, Asia, and Rest of the World (ROW).
To provide country level analysis of the market with respect to the current market size and future prospective.
To provide country level analysis of the market for segment by type, end-users and region.
To provide strategic profiling of key players in the market, comprehensively analyzing their core competencies, and drawing a competitive landscape for the market.
For the purpose of this study, Market Research Future has segmented the market of 3D ICs into technology, components, products, application and region.
Technology-
3D Stacked ICs
3D Monolithic ICs
Components-
Through Silicon Vias (TSVs)
Through Glass Vias (TGVs)
Others
Product-
CMOS Image Sensors
3D Memory
MEMS & Sensors
Light Emitting Diodes (LEDs)
Applications-
IT/Telecommunications
Consumer Electronics
Industrial
Aerospace & Defence
Automotive
Medical
Region
North-America
Europe
Asia-Pacific
RoW
Ask For Report Discount: https://www.prominentmarketresearch.com/discount-report/167
Key Players:
The key players in the global 3D IC market include Xilinx Inc.
Tezzaron Semiconductor Corporation
BeSang Inc.
Monolithic 3D Inc.
United Microelectronics Corporation
3M Company
Intel Corporation
IBM Corporation among others.
Regional Analysis:
North America is the leading economy in 3D ICs market followed by Europe. However, Asia-Pacific is the fastest growing economy in the market majorly due to maturing production sector in India and China and largest production of semiconductor industry Also, Middle East & Africa has a slow growth majorly due to growing industrialization and presence of automobile industries in this region.
Buy Report: https://www.prominentmarketresearch.com/checkout/167
Key Findings:
Global 3D ICs technology market has reached USD 4,045.87 million in 2016 and is projected to exhibit USD 10,476.60 million by the end of 2023 with a growing CAGR of 17.18%.
By technology, 3D ICs market is dominated by 3D stacked ICs which has generated USD 3,442.07 million in 2016 and projected to reach USD 8,656.95 million by the end of 2022 with 16.62% CAGR. Whereas, monolithic 3D ICs is expected to be the fastest growing market with 20.18% CAGR during forecast period 2016-2022. The high demand for cost saving and high performance logical chips is driving the 3D ICs market in the near future.
Global 3D ICs component market is dominated by through silicon vias (TSVs) which has generated USD 2,570.92 million in 2016 and projected to reach USD 7,332.03 million by the end of 2022. It also expected to be the fastest growing market with 19.08% CAGR during forecast period 2016-2022.
About Prominent Market Research:
At Prominent Market Research, we are committed to provide the best possible service and recommendations to all our customers. You will be able to speak to seasoned analyst who will understand your research needs accurately. We make it our business to look after yours, with an efficient and friendly team always available to help you.
Contact Us:
Tel - +1-815-957-4373
Email- sales@prominentmarketresearch.com
Contact Information:
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Robin
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Prominent Market Research
Robin
Tel: +1-815-957-4373
Email us
----
This press release is posted on EmailWire.com -- a global newswire that provides Press Release Distribution Services with Guaranteed Results