Bonding Films Global Market Trend, Research Approach, Data Analysis 2017 and Forecast 2023
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(EMAILWIRE.COM, December 13, 2017 ) According to Publisher, the Global Bonding Films market is expected to grow from $632.41 million in 2016 to reach $1218.14 million by 2023 with a CAGR of 9.8%. Growing demand from transportation and electrical & electronics industry, improvements in adhesive technologies, and robust properties than conventional adhesives are some of the factors boosting the market growth. In addition, raising adoption in wearable technology, growth in semi conductor industry are the other factors propelling the market growth. However, strict government regulations, large storage & heavy transportation costs are hindering the market growth.
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Among film types, eproxy films are expected to witness higher growth rate during the forecast period. The growth is attributed to high adoption in electronic industry, strong adhesive properties than conventional substrates. Epoxy bonding films are more convenient to handle, and better performers in rugged environmental conditions. By the end user, electrical & electronics segment is anticipated to command the global market with highest growth rate over the forecast period.
North America represents the largest market in terms of revenue. The Asia Pacific region is expected to register higher growth rate owing to increasing adoption of technologies and raising capital investments from major companies. Moreover, ease of raw materials accessibility, high growth of electronics industry in emerging countries such as Japan, China, and South Korea are driving the market growth in Asia Pacific region.
Some of the key players in global bonding films market include 3M, Arkema S.A., Cytec Solvay Group, Dai Nippon Printing Co., Ltd., Dupont, Fastel Adhesives & Substrate Products, Formplast, Gurit, H.B. Fuller, Henkel AG & Co. KGaA, Hexcel Corporation, Hitachi Chemical Co., Ltd., Koninklijke Ten Cate Bv, Master Bond Inc., Plitek, LLC, Pontacol AG, and Rogers Corporation.
Films Types Covered:
-Acrylic
-Epoxy
-Polyurethane
-Other Types
Technologies Covered:
-Pressure Cured
-Thermally Cured
-Other Technologies
End Users Covered:
-Packaging
-Electrical & Electronics
-Transportation
-Other End Users
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Regions Covered:
-North America
US
Canada
Mexico
-Europe
Germany
UK
Italy
France
Spain
Rest of Europe
-Asia Pacific
Japan
China
India
Australia
New Zealand
Rest of Asia Pacific
-South America
Argentina
Brazil
Chile
Rest of South America
-Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa
Company Profiling
10.1 3M
10.2 Arkema S.A.
10.3 Cytec Solvay Group
10.4 Dai Nippon Printing Co., Ltd.
10.5 Dupont
10.6 Fastel Adhesives & Substrate Products
10.7 Formplast
10.8 Gurit
10.9 H.B. Fuller
10.10 Henkel AG & Co. KGaA
10.11 Hexcel Corporation
10.12 Hitachi Chemical Co., Ltd.
10.13 Koninklijke Ten Cate Bv
10.14 Master Bond Inc.
10.15 Plitek, LLC
10.16 Pontacol AG
10.17 Rogers Corporation
For more information about this report: http://www.reportsweb.com/bonding-films-global-market-outlook-2017-2023
Request Sample Copy at http://www.reportsweb.com/inquiry&RW00011117665/sample
Among film types, eproxy films are expected to witness higher growth rate during the forecast period. The growth is attributed to high adoption in electronic industry, strong adhesive properties than conventional substrates. Epoxy bonding films are more convenient to handle, and better performers in rugged environmental conditions. By the end user, electrical & electronics segment is anticipated to command the global market with highest growth rate over the forecast period.
North America represents the largest market in terms of revenue. The Asia Pacific region is expected to register higher growth rate owing to increasing adoption of technologies and raising capital investments from major companies. Moreover, ease of raw materials accessibility, high growth of electronics industry in emerging countries such as Japan, China, and South Korea are driving the market growth in Asia Pacific region.
Some of the key players in global bonding films market include 3M, Arkema S.A., Cytec Solvay Group, Dai Nippon Printing Co., Ltd., Dupont, Fastel Adhesives & Substrate Products, Formplast, Gurit, H.B. Fuller, Henkel AG & Co. KGaA, Hexcel Corporation, Hitachi Chemical Co., Ltd., Koninklijke Ten Cate Bv, Master Bond Inc., Plitek, LLC, Pontacol AG, and Rogers Corporation.
Films Types Covered:
-Acrylic
-Epoxy
-Polyurethane
-Other Types
Technologies Covered:
-Pressure Cured
-Thermally Cured
-Other Technologies
End Users Covered:
-Packaging
-Electrical & Electronics
-Transportation
-Other End Users
Inquire before Buying at http://www.reportsweb.com/inquiry&RW00011117665/buying
Regions Covered:
-North America
US
Canada
Mexico
-Europe
Germany
UK
Italy
France
Spain
Rest of Europe
-Asia Pacific
Japan
China
India
Australia
New Zealand
Rest of Asia Pacific
-South America
Argentina
Brazil
Chile
Rest of South America
-Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa
Company Profiling
10.1 3M
10.2 Arkema S.A.
10.3 Cytec Solvay Group
10.4 Dai Nippon Printing Co., Ltd.
10.5 Dupont
10.6 Fastel Adhesives & Substrate Products
10.7 Formplast
10.8 Gurit
10.9 H.B. Fuller
10.10 Henkel AG & Co. KGaA
10.11 Hexcel Corporation
10.12 Hitachi Chemical Co., Ltd.
10.13 Koninklijke Ten Cate Bv
10.14 Master Bond Inc.
10.15 Plitek, LLC
10.16 Pontacol AG
10.17 Rogers Corporation
For more information about this report: http://www.reportsweb.com/bonding-films-global-market-outlook-2017-2023
Contact Information:
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Rajat Sahni
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ReportsWeb.com
Rajat Sahni
Tel: +1-646-491-9876
Email us
----
This press release is posted on EmailWire.com -- a global newswire that provides Press Release Distribution Services with Guaranteed Results