Thermal Interface Materials Global Market by Region & Data Validation, Analysis and Forecasts to 2022
ReportsWeb.com published “Thermal Interface Materials Market” from its database. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
(EMAILWIRE.COM, September 12, 2017 ) The Global Thermal Interface Materials market accounted for $570 million in 2015 and is expected to grow up to $1,186 million by 2022 growing at a CAGR of 11.03% from 2015 to 2022. The increasing LED market, better connectivity, stylish electronics electrification of transport are the factors that are driving the market growth. However, physical properties are one of the factors hindering the market growth. The major market share is captured by computer segment with electronic systems becoming faster, hotter, more compact, and portable, the need for better TIMs in consumer and industrial computing will continue.
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Greases & Adhesives segment is the dominating material market. Asia Pacific region is the largest and fastest growing market for greases & adhesives segment. Thermal grease is used to fill gaps between power devices and heat sinks and they remain popular in consumer electronics and industrial computing. Asia Pacific region leads the market globally with the biggest market share and is expected to grow at a high CAGR among the other regions. In Asia Pacific, China, Japan, South Korea, and India are the leading markets for Thermal Interface Materials.
Some of the key players in the global market include Henkel AG & Co. KGAA, DOW Corning Corporation, 3M Company, Parker Hannifin Corporation, Honeywell International Inc., Indium Corporation, Momentive Performance Materials Inc., The Bergquist Company, Inc., Laird Technologies, Inc., Zalman Tech Co., Ltd., Fujipoly, Graftech International Holdings Inc., Stockwell Elastomerics, Inc., Wakefield-Vette, Inc., and MH&W International.
Thermal Interface material types covered:
- Thermal Pads
- Thermal Grease
- Phase Change Material
- Gaps Fillers
- Metal-Based TIMs
- Greases & Adhesives
Products covered:
- IGBT
- Power Transistors
- Thyristor
- Mosfet
Application Covered:
- Power supply units
- Consumer Electronics
- Telecom Equipment
- Industrial Machinery
- Automotive Electronics
- Computers
- Medical Devices
- Others
.
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Regions Covered:
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- Italy
- UK
- Spain
- Rest of Europe
- Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- Rest of Asia Pacific
- Rest of the World
- Middle East
- Brazil
- Argentina
- South Africa
- Egypt
11 Company Profiling
11.1 Introduction
11.2 Henkel AG & Co. KGAA
11.3 DOW Corning Corporation
11.4 3M Company
11.5 Parker Hannifin Corporation
11.6 Honeywell International Inc.
11.7 Indium Corporation
11.8 Momentive Performance Materials Inc.
11.9 The Bergquist Company, Inc.
11.10 Laird Technologies, Inc.
11.11 Zalman Tech Co., Ltd.
11.12 Fujipoly
11.13 Graftech International Holdings Inc.
11.14 Stockwell Elastomerics, Inc.
11.15 Wakefield-Vette, Inc.
11.16 MH&W International
Make an enquiry: http://www.reportsweb.com/inquiry&RW0001153410/buying
For more information @ http://www.reportsweb.com/thermal-interface-materials-global-market-outlook-2015-2022
Greases & Adhesives segment is the dominating material market. Asia Pacific region is the largest and fastest growing market for greases & adhesives segment. Thermal grease is used to fill gaps between power devices and heat sinks and they remain popular in consumer electronics and industrial computing. Asia Pacific region leads the market globally with the biggest market share and is expected to grow at a high CAGR among the other regions. In Asia Pacific, China, Japan, South Korea, and India are the leading markets for Thermal Interface Materials.
Some of the key players in the global market include Henkel AG & Co. KGAA, DOW Corning Corporation, 3M Company, Parker Hannifin Corporation, Honeywell International Inc., Indium Corporation, Momentive Performance Materials Inc., The Bergquist Company, Inc., Laird Technologies, Inc., Zalman Tech Co., Ltd., Fujipoly, Graftech International Holdings Inc., Stockwell Elastomerics, Inc., Wakefield-Vette, Inc., and MH&W International.
Thermal Interface material types covered:
- Thermal Pads
- Thermal Grease
- Phase Change Material
- Gaps Fillers
- Metal-Based TIMs
- Greases & Adhesives
Products covered:
- IGBT
- Power Transistors
- Thyristor
- Mosfet
Application Covered:
- Power supply units
- Consumer Electronics
- Telecom Equipment
- Industrial Machinery
- Automotive Electronics
- Computers
- Medical Devices
- Others
.
Request Sample Copy http://www.reportsweb.com/inquiry&RW0001153410/sample
Regions Covered:
- North America
- US
- Canada
- Mexico
- Europe
- Germany
- France
- Italy
- UK
- Spain
- Rest of Europe
- Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- Rest of Asia Pacific
- Rest of the World
- Middle East
- Brazil
- Argentina
- South Africa
- Egypt
11 Company Profiling
11.1 Introduction
11.2 Henkel AG & Co. KGAA
11.3 DOW Corning Corporation
11.4 3M Company
11.5 Parker Hannifin Corporation
11.6 Honeywell International Inc.
11.7 Indium Corporation
11.8 Momentive Performance Materials Inc.
11.9 The Bergquist Company, Inc.
11.10 Laird Technologies, Inc.
11.11 Zalman Tech Co., Ltd.
11.12 Fujipoly
11.13 Graftech International Holdings Inc.
11.14 Stockwell Elastomerics, Inc.
11.15 Wakefield-Vette, Inc.
11.16 MH&W International
Make an enquiry: http://www.reportsweb.com/inquiry&RW0001153410/buying
Contact Information:
ReportsWeb.com
Rajat Sahni
Tel: +1-646-491-9876
Email us
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ReportsWeb.com
Rajat Sahni
Tel: +1-646-491-9876
Email us
----
This press release is posted on EmailWire.com -- a global newswire that provides Press Release Distribution Services with Guaranteed Results