Organic Substrate Packaging Material Global Market, Analysis and Forecasts to 2019
ReportsWeb.com published “Organic Substrate Packaging Material Market” from its database. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this mar
(EMAILWIRE.COM, September 06, 2017 ) Organic substrates are the base layers of individual semiconductor devices and ICs on which other layers are deposited to complete a circuit. As these materials are part of the circuit, it is imperative that they are efficient conductors of electricity, and preferably thinner core materials are used to surround them in demanding system applications. A small die (block of semiconducting material made of silicon or gallium arsenide with a fabricated circuit) is mounted on the substrate, which connects the input and output terminals from the die to a PCB.
Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.
Publisher's analysts forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.
For more information http://www.reportsweb.com/global-organic-substrate-packaging-material-market-2015-2019
Covered in this report
This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following:
- Packaging technology
- Geography
Publisher's report, Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.
Key regions
- APAC
- Europe
- North America
- ROW
Key vendors
- AJINOMOTO
- AMKOR
- ASE Kaohsiung
- Mitsubishi Gas Chemical
- SPIL
- STATS ChipPAC
Request Sample Copy http://www.reportsweb.com/inquiry&RW0001232171/sample
Market driver
- Demand for wireless devices
- For a full, detailed list, view our report
Market challenge
- Dependency on semiconductor equipment industry performance
- For a full, detailed list, view our report
Market trend
- Popularity of redistributed chip packaging
- For a full, detailed list, view our report
Make an enquiry: http://www.reportsweb.com/inquiry&RW0001232171/buying
Organic substrates are surrounded by low-loss and ultra-thin materials that have a dielectric base. A thin film layer used to protect the semiconductors on the substrate is made of polyamide and polyester films. These materials are mainly used in area array packages such as BGA and PGA.
Publisher's analysts forecast the global organic substrate packaging materials market to grow at a CAGR of 5.41% over the period 2014-2019.
For more information http://www.reportsweb.com/global-organic-substrate-packaging-material-market-2015-2019
Covered in this report
This report covers the present scenario and the growth prospects of the global organic substrate packaging materials market for the period 2015-2019. The report provides the vendor landscape and a corresponding detailed analysis of the top six vendors in the market. The market segmentation is done based on the following:
- Packaging technology
- Geography
Publisher's report, Global Organic Substrate Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts.
Key regions
- APAC
- Europe
- North America
- ROW
Key vendors
- AJINOMOTO
- AMKOR
- ASE Kaohsiung
- Mitsubishi Gas Chemical
- SPIL
- STATS ChipPAC
Request Sample Copy http://www.reportsweb.com/inquiry&RW0001232171/sample
Market driver
- Demand for wireless devices
- For a full, detailed list, view our report
Market challenge
- Dependency on semiconductor equipment industry performance
- For a full, detailed list, view our report
Market trend
- Popularity of redistributed chip packaging
- For a full, detailed list, view our report
Make an enquiry: http://www.reportsweb.com/inquiry&RW0001232171/buying
Contact Information:
ReportsWeb.com
Rajat Sahni
Tel: +1-646-491-9876
Email us
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ReportsWeb.com
Rajat Sahni
Tel: +1-646-491-9876
Email us
----
This press release is posted on EmailWire.com -- a global newswire that provides Press Release Distribution Services with Guaranteed Results